Panasonic has unveiled the third iteration of its semi-rugged laptop, the Toughbook 55 Mark 3, catering to professionals engaged in on-site inspections, infrastructure management, and emergency response.
Featuring versatile configuration options, the standout features include the latest 13th generation Intel processors. Users can choose between the Core i5-1345U (2P+8E cores, 4.7GHz boost) and the Core i7-1370P (6P+8E cores, 5.2GHz boost).
The laptop supports up to 2 DIMMs of user-upgradable RAM, ranging from 16GB to 64GB of DDR4-3200MHz, and houses a primary OPAL NVMe SSD with storage capacities ranging from 512GB to 2TB. Additional storage options are available, including a second SSD bay.
Equipped with a 14-inch display, users can opt for a 1,366 x 768px resolution or a 1,920 x 1,080px resolution with touch functionality. Both displays utilize IPS panels, while the higher resolution touch panel boasts impressive features such as a peak brightness of 1,000 nits, along with anti-reflective and anti-glare coatings.
The Toughbook 55 Mk3 comes packed with impressive features, making it more rugged than its “semi-rugged” label suggests. It boasts a robust 92dB Waves MaxxAudio speaker system for extra loud audio and features dual-array microphones with AI noise reduction for clear voice capture, even in noisy environments.
Panasonic’s “semi-rugged” designation is backed by MIL-STD-810H ratings, allowing drops up to 3 feet, and resilience against shock, vibration, altitude, freeze/thaw, and temperature shock. With an IP53 rating for dust and water resistance, the laptop goes beyond expectations by incorporating a heater for the main SSD, enabling operation in extremely cold environments.
Constructed from a magnesium alloy, the Toughbook 55 Mk3 includes an integrated handle for portability, a spill-resistant keyboard, and a raised bezel on the display for added protection. Advanced connectivity options include a Thunderbolt 4 port supporting up to 40Gbps data transfer, Display Port, Power Delivery, Wi-Fi 6E, and Bluetooth 5.3.
Setting it apart are the xPAK modules with three expansion slots (rear, left, and right). These slots accommodate various modules, enabling professionals to customize the laptop with additional features such as serial and LAN ports, fingerprint reader, barcode reader, smart card reader, optical drives, extra SSDs, and even a second battery. The latter option extends the battery life from 10 to an impressive 20 hours, with the second battery being hot-swappable.
The Toughbook 55 Mk3 boasts a range of integrated options, including a gigabit Ethernet port, dual-SIM connectivity (nano-SIM + eSIM) with a 4G modem compatible with FirstNet and CBRS Band 48. It also features a dedicated GPS receiver, an infrared camera, and more. The keyboard adds a customizable touch with keys that can launch specific applications or trigger actions such as shortcuts.
For those interested in the Core i7 processor variant, it’s currently available in North America, with further details on the official site. The version featuring an i5 processor is expected to be released in February 2024. Stay tuned for the latest updates.